We always try to support the development and technical studies of universities. Now, as a supplier of solder balls and solder flux, we have joined the project: Influence of heat flow direction on solder ball interfacial layer.
During the soldering process, a large number of factors influence the quality of the solder joint. If we focus on the intermetallic layer and the intermetallic compounds for the SAC305 soldering alloy, some fundamental parameters influencing their formation and growth have been identified.
When supplying soldering materials, we often encounter testing of different proportions of impurities. We always try to help advise what ratio is ideal for a particular operation. Thanks to the fact that our production is in the Czech Republic, we can flexibly respond to the needs of our customers and supply soldering materials in a very short time.
The results of the solder-copper interface analysis showed different values in terms of the thickness of the intermetallic layer and its roughness. One of the basic parameters that could influence the test results was the soldering profile. For exact verification of the correct settings of the temperature profiles, a heating factor calculation was used to help optimize the soldering profile from the point of view of reliability control, repeatability, soldering process and quality of the resulting soldered joint.
More information can be found in the attached document, which relates to the work. Thank you for participating in this project.
4_118-07