H63S-B Solder Bar
Product description
Alloy: Sn63/Pb37
Melting point: 183°C
Package: 1.0kg/pcs, 20kg/box
High purity alloy that is composed of 63% Tin, and 37% Lead.
Reduces defects in the wave.
Exhibits less dross flows well and can reduce bridging during soldering.
Solder bar for plating process or wave soldering process.
Composed of virgin raw metals with low impurities.
AVAILABLE OPTIONS FOR SOLDER BARS
If interested, please contact us for a specific offer.
| Alloy | Composition | Melting Point (°C) |
|---|---|---|
| SnAgCu Series | ||
| PF606-B | Sn/Ag3.0/Cu0.5/X | 217-219 |
| PF629-B | Sn/Ag0.3/Cu0.7 | 217-226 |
| PF632-B | Sn/Ag1.0/Cu0.5 | 217-226 |
| SnCu Series | ||
| PF604-B | Sn/Cu0.7 | 227-228 |
| PF643-B | Sn/Cu0.7/Ni0.04 | 227-228 |
| PF656-B | Sn/Ag0.05/Cu0.7/X | 227-228 |
| PF660-B | Sn/Cu0.2/Ni0.03/Ga0.002 | 227-228 |
| PF665-B | Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05 | 227-228 |
| PF731-B | Sn/Cu3.0/Ni0.2/X | 227-340 |
| PF732-B | Sn/Cu5.0/Ni0.2/X | 227-370 |
| SnAg Series | ||
| PF616-B | Sn/Ag4.0 | 221-225 |
| Pure Sn Series | ||
| PF605-B | Sn99.99 | 232 |
| Lead Containing Series | ||
| SH63-B | Sn/Pb37 | 183 |
| SH62-B | Sn/Pb36/Ag2 | 179 |
| SH-0595-B | Sn/Pb95 | 308-312 |
| SH-05X25-B | Sn/Pb92.5/Ag2.5 | 280-284 |
| SH-10882-B | Sn/Pb88/Ag2 | 268-290 |
| Low Temperature Series | ||
| PF602-B | Sn/Bi58 | 139 |
| PF653-B | Sn/Bi57/Ag1.0 | 137-142 |
| PF676-B | Sn/Bi57.6/Ag0.4 | 137-142 |
| PF735-B | Sn/Bi57/Ag/X | 137/142 |
| SnSb Series | ||
| PF623-B | Sn/Sb5.0 | 238-241 |
| PF726-B | Sn/Sb10 | 245-266 |
Solder Bar is made from high purity metal resulting in low drossing and is suitable for dip and wave soldering. The quality meets JIS-Z-3282.