PF665-B Lead Free Solder Bar
Product description
Alloy: Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05
Melting point: 227-228°C
Package: 1.0kg/pcs, 20kg/box
Bright and shiny surface finishes.
Solder bar for plating process or wave soldering process.
Composed of virgin raw metals with low impurities.
AVAILABLE OPTIONS FOR SOLDER BARS
If interested, please contact us for a specific offer.
Alloy | Composition | Melting Point (°C) |
---|---|---|
SnAgCu Series | ||
PF606-B | Sn/Ag3.0/Cu0.5/X | 217-219 |
PF629-B | Sn/Ag0.3/Cu0.7 | 217-226 |
PF632-B | Sn/Ag1.0/Cu0.5 | 217-226 |
SnCu Series | ||
PF604-B | Sn/Cu0.7 | 227-228 |
PF643-B | Sn/Cu0.7/Ni0.04 | 227-228 |
PF656-B | Sn/Ag0.05/Cu0.7/X | 227-228 |
PF660-B | Sn/Cu0.2/Ni0.03/Ga0.002 | 227-228 |
PF665-B | Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05 | 227-228 |
PF731-B | Sn/Cu3.0/Ni0.2/X | 227-340 |
PF732-B | Sn/Cu5.0/Ni0.2/X | 227-370 |
SnAg Series | ||
PF616-B | Sn/Ag4.0 | 221-225 |
Pure Sn Series | ||
PF605-B | Sn99.99 | 232 |
Lead Containing Series | ||
SH63-B | Sn/Pb37 | 183 |
SH62-B | Sn/Pb36/Ag2 | 179 |
SH-0595-B | Sn/Pb95 | 308-312 |
SH-05X25-B | Sn/Pb92.5/Ag2.5 | 280-284 |
SH-10882-B | Sn/Pb88/Ag2 | 268-290 |
Low Temperature Series | ||
PF602-B | Sn/Bi58 | 139 |
PF653-B | Sn/Bi57/Ag1.0 | 137-142 |
PF676-B | Sn/Bi57.6/Ag0.4 | 137-142 |
PF735-B | Sn/Bi57/Ag/X | 137/142 |
SnSb Series | ||
PF623-B | Sn/Sb5.0 | 238-241 |
PF726-B | Sn/Sb10 | 245-266 |
Solder Bar is made from high purity metal resulting in low drossing and is suitable for dip and wave soldering. The quality meets JIS-Z-3282.