Products

SOLDER PASTE

Lead content PN Alloy Melting Point Type Halogen-Free Halogen containing
Lead-Free PF606 Sn96.5/Ag3.0/Ciu0.5 217-219 °C T3-T6
PF629 Sn99.0/Ag0.3/Cu0.7 217-226 °C T3-T5
PF602 Sn42/Bi58 139 °C T3-T4
Lead containing SH-62 Sn62/Pb36/Ag2 179-189 °C T3-T4
SH-63 Sn63/Pb37 183 °C T3-T4
Type Particle size
T3 20-45 μm
T4 20-38 μm
T5 15-25 μm
T6 5-15 μm
T7 2-12 μm
T8 2-10 μm

Special Applications

  • Low temperature
  • Wafer Bumping
  • Laser soldering
  • Water soluble
  • Dispensing
  • High temperature
  • PoP
  • LED (low voiding)
  • Room temperature storable
  • Jetting

Packaging

  • Jars 250g – 500g – 2000g
  • Semco cartridges – 6oz (600g) – 12oz (1200g)
  • Syringes – 10cc (30g) – 30cc (100g) – 55cc (150g)

SOLDER WIRE (flux cored)

PN Alloy Flux content Diameters Reel size
PF604-R Sn99.3/Cu0.7 3±1% 0.5 – 0.7 – 1.0mm 500g
PF606-R Sn96.5/Ag3.0/Cu0.5 3±1% 0.5 – 0.7 – 1.0mm 500g
RH63-A Sn63/Pb37 2±1% 0.5 – 0.7 – 1.0mm 500g

Other Alloys, diameters (0.3 – 3.0mm), fluxes and reel sizes upon request. Solid wires (without flux) are also available.

SOLID SOLDER WIRE

PN Alloy Flux content Diameters Reel size
PF606-H Sn96.5/Ag3.0/Cu0.5 without Flux 3.0mm 4000g

SOLDER BAR

PN Alloy Melting Point
PF606-B Sn96.5/Ag3.0/Cu0.5 217-219 °C
PF629-B Sn99/Ag0.3/Su0.7 217-226 °C
PF604-B Sn/Cu0.7 227-228 °C
PF665-B Sn/Cu0.7/Ni0.025/Ge0.01/Ag0.05 227-228 °C
PF660-B Sn/Cu0.2/Ni0.03/Ga0.002 232-234 °C
H63S-B Sn63/Pb37 183 °C

Other alloys upon request.

SOLDER FLUX

PNApplication
SMF-2For BGA rework
SMF-2LFor BGA rework with lower viscosity
SMF-08For BGA ball attachment
SMF-B01For BGA ball attachment,
especially for μBGA
SM-816Liquid flux for wave soldering

SOLDER SPHERE

PNAlloy
PF682-SSn/Ag1.2/Ci0.5/Ni0.05
PF683-SSn/Ag1.0/Cu0.5
PF684-SSn/Ag3.0/Cu0.5
PF685-SSn/Ag4.0/Cu0.5
PF687-SSn/Ag3.5

Other alloys upon request. Solder spheres are available in diameters ranging from 0,05 – 0,76 mm.

SOLDER PREFORM

Standard alloys: SAC305
Standard sizes: 0201, 0402, 0603, 0805
Standard packaging: Tape&Reel
Other alloys, shapes and packaging types upon request.