Solder paste

SOLDER PASTE

Lead content PN Alloy Melting Point Type Halogen-Free Halogen containing
Lead-Free PF606 Sn96.5/Ag3.0/Ciu0.5 217-219 °C T3-T6 √ √
PF629 Sn99.0/Ag0.3/Cu0.7 217-226 °C T3-T5 √ √
PF602 Sn42/Bi58 139 °C T3-T4 √ √
Lead containing SH-62 Sn62/Pb36/Ag2 179-189 °C T3-T4 √ √
SH-63 Sn63/Pb37 183 °C T3-T4 √ √
Type Particle size
T3 20-45 μm
T4 20-38 μm
T5 15-25 μm
T6 5-15 μm
T7 2-12 μm
T8 2-10 μm

Special Applications

  • Low temperature
  • Wafer Bumping
  • Laser soldering
  • Water soluble
  • Dispensing
  • High temperature
  • PoP
  • LED (low voiding)
  • Room temperature storable
  • Jetting

Packaging

  • Jars 250g – 500g – 2000g
  • Semco cartridges – 6oz (600g) – 12oz (1200g)
  • Syringes – 10cc (30g) – 30cc (100g) – 55cc (150g)